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P type Silicon Carbide Wafer

CN → US
HS编码 关税税率 原产国 目的国 文档
2849201000 10.0% CN US 官方文档
2849202000 10.5% CN US 官方文档
8541100040 60.0% CN US 官方文档
8541590040 60.0% CN US 官方文档
8541497040 60.0% CN US 官方文档

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AI分析

⚡ P-Type Silicon Carbide (SiC) Wafer


🌐 HS Code Reference & Customs Clearance Guide | 2026 Latest Tariff Analysis | Strategic Clearance Strategy
📌 I. Product Definition & Classification: Do You Really Understand "P-Type SiC Wafers"?

Silicon Carbide (SiC) is a wide-bandgap semiconductor material prized for its high thermal conductivity, high breakdown voltage, and ability to operate at high temperatures. It is the backbone of next-generation electric vehicles (EVs), renewable energy inverters, and high-power industrial electronics.

In international trade, SiC wafers are classified based on their degree of processing and semiconductor functionality:

  1. Primary Form / Unprocessed Wafers: Raw SiC crystals sliced into wafers but not yet fabricated into electronic devices. These are considered "chemical products" or "semiconductor substrates."
  2. Processed/Refined Wafers: Wafers that have undergone specific surface treatments, polishing, or slicing to specific thicknesses for device fabrication.
  3. Unassembled Semiconductor Devices (Chips/Dies/Wafers): SiC wafers that have been processed into functional diodes, transistors, or integrated circuits, even if not yet packaged. These are considered "electronic components."

⚠️ Critical Distinction Point:
- If the product is a bare wafer (substrate only, no active device structures) → It falls under Chapter 28 (Chemical Products).
- If the product has active device structures (diodes, MOSFETs fabricated on the wafer) but is unpacked → It falls under Chapter 85 (Electrical Machinery).


📦 II. HS Code Classification Details (2026 Latest Tariff Authority Comparison)

HS Code Product Description Application Scenario Degree of Processing
2849.20.10.00 Silicon Carbide in Primary Forms; Wafers Raw SiC wafers, substrates for epitaxy, basic semiconductor material ✅ Primary Form (Unprocessed/Basic)
2849.20.20.00 Silicon Carbide in Primary Forms; Refined Slices/Sheets Polished SiC wafers, specific thickness slices for advanced packaging ✅ Refined/Sliced
8541.10.00.40 P-N Junction Diodes (Unassembled) SiC Wafers with fabricated diode structures, unmounted chips/dies ✅ Functional Device (Unassembled)
8541.59.00.40 Other Semiconductor Devices (Unassembled) SiC wafers with transistor/IC structures, unmounted dies ✅ Functional Device (Unassembled)
8541.49.70.40 Other Semiconductor Devices (Silicon) Note: This code is for Silicon, not SiC. Often confused. SiC devices do NOT go here. ❌ Wrong Material (Si vs. SiC)

🔍 Key Reminder:
- P-Type refers to the doping characteristic, not the final product form.
- Wafers without active devices = 2849.xx.
- Wafers/Wafer-level chips WITH active devices = 8541.xx.
- DO NOT use 8541.49.70.40 for SiC; this is strictly for Silicon devices.


💰 III. 2026 Latest Tariff Rate Breakdown (Including Surtaxes & Policy Add-ons)

Applicable Country: United States (US)
Origin: China (CN)
Effective Date: From November 10, 2025 (including subsequent imports)

🎯 1. 2849.20.10.00 —— Silicon Carbide, Primary Form (Raw Wafers)

Item Content
Base Tariff 0.0% (ad valorem)
Section 301 Surcharge 0.0%
122 Clause Tariff +10.0% (Specific to certain semiconductor materials)
Total Tariff Rate 10.0%
Tax Calculation CIF Value × 10%
De Minimis Exemption Not Eligible (Subject to scrutiny)
Legal Basis Path HTSUS:2849.20.10.00Executive Order 122

📌 Explanation:
- Raw SiC wafers are classified as "primary forms" of chemical products.
- Although base tariff is 0%, the 10% Section 122 tariff applies specifically to certain semiconductor raw materials.
- This is a low-risk, low-cost classification for pure substrates.

🎯 2. 2849.20.20.00 —— Silicon Carbide, Refined Slices/Sheets

Item Content
Base Tariff 0.5%
Section 301 Surcharge 0.0%
122 Clause Tariff +10.0%
Total Tariff Rate 10.5%
Tax Calculation CIF Value × 10.5%
De Minimis Exemption Not Eligible
Legal Basis Path HTSUS:2849.20.20.00Executive Order 122

📌 Note:
- If your wafers are highly polished or sliced to precise tolerances for advanced packaging, they may fall under this "Refined" category.
- The extra 0.5% base tariff is negligible, but the 10% 122 tariff remains the dominant cost driver.

🎯 3. 8541.10.00.40 & 8541.59.00.40 —— Unassembled SiC Semiconductor Devices

Item Content
Base Tariff 0.0%
Section 301 Surcharge +50.0%
122 Clause Tariff +10.0%
Total Tariff Rate 60.0%
Tax Calculation CIF Value × 60%
De Minimis Exemption Not Eligible
Legal Basis Path HTSUS:8541.xx.xx.40Section 301 + Executive Order 122

📌 Critical Warning:
- If the SiC wafer contains fabricated devices (e.g., diodes, MOSFETs) even if unmounted, it is treated as an electronic component.
- The tariff skyrockets to 60%.
- This includes Section 301 (50%) and 122 Clause (10%).
- DO NOT classify device-level SiC wafers as 2849.xx to avoid penalties.

🎯 4. 8541.49.70.40 —— ERROR CODE FOR SIC

Item Content
Base Tariff 0.0%
Section 301 Surcharge +50.0%
122 Clause Tariff +10.0%
Total Tariff Rate 60.0%
Legal Basis Path HTSUS:8541.49.70.40

📌 Note:
- This code is for Silicon (Si) devices, NOT Silicon Carbide (SiC).
- Misclassifying SiC as Silicon here is a customs violation.
- While the rate is also 60%, the material mismatch will trigger audits, fines, and shipment holds.


🛠️ IV. Customs Clearance Practical Advice (Avoiding Pitfalls)

✅ 1. Required Documentation Checklist (Non-Negotiable)

Document Must Provide Description
Technical Data Sheet (TDS) ✔️ Must specify: Material (SiC vs. Si), Doping (P-Type/N-Type), Diameter, Thickness, Resistivity.
Certificate of Origin (CO) ✔️ To determine preferential status (if any) and origin verification.
Commercial Invoice ✔️ Clear description: "P-Type Silicon Carbide Wafer, Material: SiC, Not Assembled Semiconductor Device."
Packing List ✔️ Detail packaging to prevent damage and verify quantity.
Photographs ✔️ Show wafer surface, labeling, and packaging.
Manufacturer’s Declaration ✔️ Explicitly state: "This product is a substrate/wafer in primary form (HS 2849) and does NOT contain functional electronic devices."

✅ 2. Declaration Strategy (Key Mantra)

🔥 "Substrate is 2849, Device is 8541. Don't mix them, or you'll pay 60%!"

Scenario Correct Declaration Wrong Declaration Consequence
Raw SiC Wafer 2849.20.10.00 8541.10.00.40 Overpay 50%
SiC Wafer with Diodes 8541.10.00.40 2849.20.10.00 Smuggling/Penalty Risk
Silicon Wafer 8541.49.70.40 8541.59.00.40 Minor Error, but Audit Risk
SiC Wafer 8541.59.00.40 8541.49.70.40 Material Misclassification

✅ 3. Special Cases Handling

Situation Handling Advice
SiC vs. Silicon Confusion Always specify "Silicon Carbide" in English and HS Code. Do NOT use "Silicon Wafer" generic terms.
Wafer with Epitaxial Layer If only epitaxy is added (no devices), it may still qualify for 2849. However, if it includes doped regions for devices, it may be 8541. Get a pre-ruling.
Cut Wafer Fragments If the product is "SiC slices" rather than full wafers, it may still fall under 2849.20.20.00.
OEM Custom Wafers Provide customer specifications to prove whether it is a substrate or a device.

🌍 V. Global Market Comparison (2026 Latest)

Country/Region Recommended HS Code Tariff Rate Certification Required Remarks
🇺🇸 USA 2849.20.10.00 10.0% None (Basic) High scrutiny on "122 Clause" materials.
🇺🇸 USA 8541.10.00.40 60.0% None Avoid if possible; high cost.
🇨🇳 China 2849.20.10.00 0% N/A Import tariff is low, but watch for domestic policies.
🇪🇺 EU 2849.20.10.00 0% CE (if end-product) No surtaxes like US Section 301.
🇯🇵 Japan 2849.20.10.00 0% PSE (if end-product) Favorable for semiconductor materials.

📌 Conclusion:
- USA is the most expensive market for SiC semiconductors due to Section 301 (50%) and 122 Clause (10%).
- For substrates (2849), the rate is manageable (10-10.5%).
- For devices (8541), the rate is prohibitive (60%).
- EU and Japan offer much more competitive rates for SiC materials.


📌 VI. Common Mistakes & Pitfalls (Lessons Learned)

Mistake 1: Classifying device-level SiC wafers as raw materials (2849)
👉 Consequence: Customs detection via X-ray or technical audit → 60% tariff + fines + seizure.

Mistake 2: Using 8541.49.70.40 (Silicon code) for SiC
👉 Consequence: Material misdeclaration → Audit, delays, and potential legal action.

Mistake 3: Not specifying "P-Type" or "SiC" in the description
👉 Consequence: Customs may treat it as generic Silicon → Incorrect classification.

Correct Approach:

"P-Type Silicon Carbide (SiC) Wafer, Diameter: 150mm, Thickness: 675μm, Resistivity: 0.015-0.025 Ω·cm, Substrate Only, No Active Devices."


🎯 VII. Conclusion: Precise Classification Saves Money!

🎯 Remember the Mantra:

🔹 "Substrate = 2849 (10%), Device = 8541 (60%).
🔹 "SiC is NOT Silicon. Don't use 8541.49.70.40!"
🔹 "122 Clause adds 10% to Materials. Section 301 adds 50% to Devices."


📌 Pro Tip:
If your SiC wafers are for R&D and not yet commercialized, consider declaring them as "Samples for R&D" where applicable, but ensure they are truly unfunctional. For commercial shipments, pre-clearance rulings are highly recommended to avoid the 60% trap.


📣 Immediate Action:

📞 Contact a professional customs broker + Provide technical specs + Apply for HS Code Pre-Ruling
🚀 Ensure your SiC wafers clear customs smoothly, minimize costs, and maximize profits!


Professional clearance starts with precise classification!
💼 Every percentage point of tariff matters!

用户评价

关于 HS 编码归类

协调制度(HS)是由世界海关组织(WCO)制定的国际贸易商品分类标准。全球 200 多个国家采用 HS 系统作为海关关税、贸易统计和进出口监管的基础。

每个 HS 编码遵循以下层级结构:

  • 章(2 位)——商品大类(例如:第 84 章:机器和机械设备)
  • 品目(4 位)——章内的更具体分类
  • 子目(6 位)——国际通用细分,所有 WCO 成员国统一使用
  • 本国细分(8-10 位)——各国自行扩展的细分编码,如美国 HTSUS 10 位编码

正确的 HS 编码归类对于顺利通关、准确缴纳关税和遵守贸易法规至关重要。错误归类可能导致海关延误、多缴关税或罚款。

CN进口到US时,适用的关税税率可能包括:

  • 最惠国(MFN)税率——适用于 WTO 成员国的标准关税税率
  • 普通税率——适用于无贸易协定国家
  • 贸易救济关税——附加关税,如 301 条款(反倾销)、232 条款(国家安全)或反补贴税

本页内容仅供参考。如需正式归类,请咨询当地海关或持牌报关代理。