P type Silicon Carbide Wafer
CN β US| HS Code | Tariff Rate | Origin | Destination | Doc |
|---|---|---|---|---|
| 2849201000 | 10.0% | CN | US | Official Doc |
| 2849202000 | 10.5% | CN | US | Official Doc |
| 8541100040 | 60.0% | CN | US | Official Doc |
| 8541590040 | 60.0% | CN | US | Official Doc |
| 8541497040 | 60.0% | CN | US | Official Doc |
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AI Analysis
β‘ P-Type Silicon Carbide (SiC) Wafer
π HS Code Reference & Customs Clearance Guide | 2026 Latest Tariff Analysis | Strategic Clearance Strategy
π I. Product Definition & Classification: Do You Really Understand "P-Type SiC Wafers"?
Silicon Carbide (SiC) is a wide-bandgap semiconductor material prized for its high thermal conductivity, high breakdown voltage, and ability to operate at high temperatures. It is the backbone of next-generation electric vehicles (EVs), renewable energy inverters, and high-power industrial electronics.
In international trade, SiC wafers are classified based on their degree of processing and semiconductor functionality:
- Primary Form / Unprocessed Wafers: Raw SiC crystals sliced into wafers but not yet fabricated into electronic devices. These are considered "chemical products" or "semiconductor substrates."
- Processed/Refined Wafers: Wafers that have undergone specific surface treatments, polishing, or slicing to specific thicknesses for device fabrication.
- Unassembled Semiconductor Devices (Chips/Dies/Wafers): SiC wafers that have been processed into functional diodes, transistors, or integrated circuits, even if not yet packaged. These are considered "electronic components."
β οΈ Critical Distinction Point:
- If the product is a bare wafer (substrate only, no active device structures) β It falls under Chapter 28 (Chemical Products).
- If the product has active device structures (diodes, MOSFETs fabricated on the wafer) but is unpacked β It falls under Chapter 85 (Electrical Machinery).
π¦ II. HS Code Classification Details (2026 Latest Tariff Authority Comparison)
| HS Code | Product Description | Application Scenario | Degree of Processing |
|---|---|---|---|
2849.20.10.00 |
Silicon Carbide in Primary Forms; Wafers | Raw SiC wafers, substrates for epitaxy, basic semiconductor material | β Primary Form (Unprocessed/Basic) |
2849.20.20.00 |
Silicon Carbide in Primary Forms; Refined Slices/Sheets | Polished SiC wafers, specific thickness slices for advanced packaging | β Refined/Sliced |
8541.10.00.40 |
P-N Junction Diodes (Unassembled) | SiC Wafers with fabricated diode structures, unmounted chips/dies | β Functional Device (Unassembled) |
8541.59.00.40 |
Other Semiconductor Devices (Unassembled) | SiC wafers with transistor/IC structures, unmounted dies | β Functional Device (Unassembled) |
8541.49.70.40 |
Other Semiconductor Devices (Silicon) | Note: This code is for Silicon, not SiC. Often confused. SiC devices do NOT go here. | β Wrong Material (Si vs. SiC) |
π Key Reminder:
- P-Type refers to the doping characteristic, not the final product form.
- Wafers without active devices = 2849.xx.
- Wafers/Wafer-level chips WITH active devices = 8541.xx.
- DO NOT use8541.49.70.40for SiC; this is strictly for Silicon devices.
π° III. 2026 Latest Tariff Rate Breakdown (Including Surtaxes & Policy Add-ons)
β Applicable Country: United States (US)
β Origin: China (CN)
β Effective Date: From November 10, 2025 (including subsequent imports)
π― 1. 2849.20.10.00 ββ Silicon Carbide, Primary Form (Raw Wafers)
| Item | Content |
|---|---|
| Base Tariff | 0.0% (ad valorem) |
| Section 301 Surcharge | 0.0% |
| 122 Clause Tariff | +10.0% (Specific to certain semiconductor materials) |
| Total Tariff Rate | 10.0% |
| Tax Calculation | CIF Value Γ 10% |
| De Minimis Exemption | β Not Eligible (Subject to scrutiny) |
| Legal Basis Path | HTSUS:2849.20.10.00 β Executive Order 122 |
π Explanation:
- Raw SiC wafers are classified as "primary forms" of chemical products.
- Although base tariff is 0%, the 10% Section 122 tariff applies specifically to certain semiconductor raw materials.
- This is a low-risk, low-cost classification for pure substrates.
π― 2. 2849.20.20.00 ββ Silicon Carbide, Refined Slices/Sheets
| Item | Content |
|---|---|
| Base Tariff | 0.5% |
| Section 301 Surcharge | 0.0% |
| 122 Clause Tariff | +10.0% |
| Total Tariff Rate | 10.5% |
| Tax Calculation | CIF Value Γ 10.5% |
| De Minimis Exemption | β Not Eligible |
| Legal Basis Path | HTSUS:2849.20.20.00 β Executive Order 122 |
π Note:
- If your wafers are highly polished or sliced to precise tolerances for advanced packaging, they may fall under this "Refined" category.
- The extra 0.5% base tariff is negligible, but the 10% 122 tariff remains the dominant cost driver.
π― 3. 8541.10.00.40 & 8541.59.00.40 ββ Unassembled SiC Semiconductor Devices
| Item | Content |
|---|---|
| Base Tariff | 0.0% |
| Section 301 Surcharge | +50.0% |
| 122 Clause Tariff | +10.0% |
| Total Tariff Rate | 60.0% |
| Tax Calculation | CIF Value Γ 60% |
| De Minimis Exemption | β Not Eligible |
| Legal Basis Path | HTSUS:8541.xx.xx.40 β Section 301 + Executive Order 122 |
π Critical Warning:
- If the SiC wafer contains fabricated devices (e.g., diodes, MOSFETs) even if unmounted, it is treated as an electronic component.
- The tariff skyrockets to 60%.
- This includes Section 301 (50%) and 122 Clause (10%).
- DO NOT classify device-level SiC wafers as2849.xxto avoid penalties.
π― 4. 8541.49.70.40 ββ ERROR CODE FOR SIC
| Item | Content |
|---|---|
| Base Tariff | 0.0% |
| Section 301 Surcharge | +50.0% |
| 122 Clause Tariff | +10.0% |
| Total Tariff Rate | 60.0% |
| Legal Basis Path | HTSUS:8541.49.70.40 |
π Note:
- This code is for Silicon (Si) devices, NOT Silicon Carbide (SiC).
- Misclassifying SiC as Silicon here is a customs violation.
- While the rate is also 60%, the material mismatch will trigger audits, fines, and shipment holds.
π οΈ IV. Customs Clearance Practical Advice (Avoiding Pitfalls)
β 1. Required Documentation Checklist (Non-Negotiable)
| Document | Must Provide | Description |
|---|---|---|
| β Technical Data Sheet (TDS) | βοΈ | Must specify: Material (SiC vs. Si), Doping (P-Type/N-Type), Diameter, Thickness, Resistivity. |
| β Certificate of Origin (CO) | βοΈ | To determine preferential status (if any) and origin verification. |
| β Commercial Invoice | βοΈ | Clear description: "P-Type Silicon Carbide Wafer, Material: SiC, Not Assembled Semiconductor Device." |
| β Packing List | βοΈ | Detail packaging to prevent damage and verify quantity. |
| β Photographs | βοΈ | Show wafer surface, labeling, and packaging. |
| β Manufacturerβs Declaration | βοΈ | Explicitly state: "This product is a substrate/wafer in primary form (HS 2849) and does NOT contain functional electronic devices." |
β 2. Declaration Strategy (Key Mantra)
π₯ "Substrate is 2849, Device is 8541. Don't mix them, or you'll pay 60%!"
| Scenario | Correct Declaration | Wrong Declaration | Consequence |
|---|---|---|---|
| Raw SiC Wafer | 2849.20.10.00 |
8541.10.00.40 |
Overpay 50% |
| SiC Wafer with Diodes | 8541.10.00.40 |
2849.20.10.00 |
Smuggling/Penalty Risk |
| Silicon Wafer | 8541.49.70.40 |
8541.59.00.40 |
Minor Error, but Audit Risk |
| SiC Wafer | 8541.59.00.40 |
8541.49.70.40 |
Material Misclassification |
β 3. Special Cases Handling
| Situation | Handling Advice |
|---|---|
| SiC vs. Silicon Confusion | Always specify "Silicon Carbide" in English and HS Code. Do NOT use "Silicon Wafer" generic terms. |
| Wafer with Epitaxial Layer | If only epitaxy is added (no devices), it may still qualify for 2849. However, if it includes doped regions for devices, it may be 8541. Get a pre-ruling. |
| Cut Wafer Fragments | If the product is "SiC slices" rather than full wafers, it may still fall under 2849.20.20.00. |
| OEM Custom Wafers | Provide customer specifications to prove whether it is a substrate or a device. |
π V. Global Market Comparison (2026 Latest)
| Country/Region | Recommended HS Code | Tariff Rate | Certification Required | Remarks |
|---|---|---|---|---|
| πΊπΈ USA | 2849.20.10.00 |
10.0% | None (Basic) | High scrutiny on "122 Clause" materials. |
| πΊπΈ USA | 8541.10.00.40 |
60.0% | None | Avoid if possible; high cost. |
| π¨π³ China | 2849.20.10.00 |
0% | N/A | Import tariff is low, but watch for domestic policies. |
| πͺπΊ EU | 2849.20.10.00 |
0% | CE (if end-product) | No surtaxes like US Section 301. |
| π―π΅ Japan | 2849.20.10.00 |
0% | PSE (if end-product) | Favorable for semiconductor materials. |
π Conclusion:
- USA is the most expensive market for SiC semiconductors due to Section 301 (50%) and 122 Clause (10%).
- For substrates (2849), the rate is manageable (10-10.5%).
- For devices (8541), the rate is prohibitive (60%).
- EU and Japan offer much more competitive rates for SiC materials.
π VI. Common Mistakes & Pitfalls (Lessons Learned)
β Mistake 1: Classifying device-level SiC wafers as raw materials (2849)
π Consequence: Customs detection via X-ray or technical audit β 60% tariff + fines + seizure.
β Mistake 2: Using 8541.49.70.40 (Silicon code) for SiC
π Consequence: Material misdeclaration β Audit, delays, and potential legal action.
β Mistake 3: Not specifying "P-Type" or "SiC" in the description
π Consequence: Customs may treat it as generic Silicon β Incorrect classification.
β Correct Approach:
"P-Type Silicon Carbide (SiC) Wafer, Diameter: 150mm, Thickness: 675μm, Resistivity: 0.015-0.025 Ω·cm, Substrate Only, No Active Devices."
π― VII. Conclusion: Precise Classification Saves Money!
π― Remember the Mantra:
πΉ "Substrate = 2849 (10%), Device = 8541 (60%).
πΉ "SiC is NOT Silicon. Don't use 8541.49.70.40!"
πΉ "122 Clause adds 10% to Materials. Section 301 adds 50% to Devices."
π Pro Tip:
If your SiC wafers are for R&D and not yet commercialized, consider declaring them as "Samples for R&D" where applicable, but ensure they are truly unfunctional. For commercial shipments, pre-clearance rulings are highly recommended to avoid the 60% trap.
π£ Immediate Action:
π Contact a professional customs broker + Provide technical specs + Apply for HS Code Pre-Ruling
π Ensure your SiC wafers clear customs smoothly, minimize costs, and maximize profits!
β¨ Professional clearance starts with precise classification!
πΌ Every percentage point of tariff matters!
Customer Reviews
About HS Code Classification
The Harmonized System (HS) is an internationally standardized nomenclature developed by the World Customs Organization (WCO) to classify traded products. Over 200 countries use the HS system as the basis for customs tariffs, trade statistics, and import/export regulations.
Each HS code follows a hierarchical structure:
- Chapter (2 digits) β Broad category of goods (e.g., Chapter 84: Machinery and Mechanical Appliances)
- Heading (4 digits) β More specific grouping within the chapter
- Subheading (6 digits) β Internationally standardized breakdown, used by all WCO member countries
- National subdivisions (8-10 digits) β Country-specific extensions for further classification, such as US HTSUS 10-digit codes
Correct HS code classification is essential for smooth customs clearance, accurate duty payment, and compliance with trade regulations. Misclassification can lead to customs delays, overpayment of duties, or penalties.
When importing from CN to US, the applicable tariff rates may include:
- Most-Favored-Nation (MFN) rate β The standard duty rate applied to WTO members
- General rate β Applied to countries without trade agreements
- Trade remedy duties β Additional tariffs such as Section 301 (anti-dumping), Section 232 (national security), or countervailing duties
The information provided on this page is for reference purposes only. For official classification, please consult with your local customs authority or a licensed customs broker.